Sensor-based Modeling and Monitoring of Chemical Mechanical Polishing (Paperback)

This book provides a framework for real time control of the Chemical Mechanical Planarization (CMP) process based on combining nonlinear dynamics principles with statistical process monitoring approaches. CMP has a direct bearing on the computational speed and dimensional characteristics of solid state devices. The challenge in CMP may be narrowed to domains enveloping productivity, measured in terms of material removal rate (MRR), and quality which is usually specified in terms of surface roughness - Ra, within wafer non-uniformity (WIWNU), defect rate, etc. In this work, experimental investigations of CMP are executed with the aid of sensors. The analysis of the data reveals the presence of pronounced stochastic-dynamic characteristics. As a result, we derive a process control method integrating statistical time series analysis and nonlinear dynamics which captures 80% (linear R-sq) of the variation in MRR. In this manner a novel paradigm for effective process control in CMP has been presented.

General

Imprint:	VDM Verlag
Country of origin:	Germany
Release date:	December 2008
First published:	December 2008
Authors:	Prahalada Rao • Ranga Komanduri • Satish Bukkapatnam
Dimensions:	229 x 152 x 11mm (L x W x T)
Format:	Paperback - Trade
Pages:	208
ISBN-13:	978-3-639-03564-3
Categories:	Books > Science & Mathematics > Mathematics > General Books > Science & Mathematics > Physics > General Books > Professional & Technical > Technology: general issues > Engineering: general Promotions
LSN:	3-639-03564-X
Barcode:	9783639035643

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