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Synthesis of Power Distribution to Manage Signal Integrity in Mixed-Signal ICs (Paperback, Softcover reprint of the original 1st ed. 1996)
Loot Price: R2,985
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Synthesis of Power Distribution to Manage Signal Integrity in Mixed-Signal ICs (Paperback, Softcover reprint of the original 1st ed. 1996)
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In the early days of VLSI, the design of the power distribution for
an integrated cir cuit was rather simple. Power distribution --the
design of the geometric topology for the network of wires that
connect the various power supplies, the widths of the indi vidual
segments for each of these wires, the number and location of the
power I/O pins around the periphery of the chip --was simple
because the chips were simpler. Few available wiring layers forced
floorplans that allowed simple, planar (non-over lapping) power
networks. Lower speeds and circuit density made the choice of the
wire widths easier: we made them just fat enough to avoid resistive
voltage drops due to switching currents in the supply network. And
we just didn't need enormous num bers of power and ground pins on
the package for the chips to work. It's not so simple any more.
Increased integration has forced us to focus on reliability
concerns such as metal elec tromigration, which affects wire sizing
decisions in the power network. Extra metal layers have allowed
more flexibility in the topological layout of the power networks."
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