Examines all important aspects of integrated circuit design,
fabrication, assembly and test processes as they relate to quality
and reliability. This second edition discusses in detail: the
latest circuit design technology trends; the sources of error in
wafer fabrication and assembly; avenues of contamination; new IC
packaging methods; new in-line process monitors and test
structures; and more.;This work should be useful to electrical and
electronics, quality and reliability, and industrial engineers;
computer scientists; integrated circuit manufacturers; and
upper-level undergraduate, graduate and continuing-education
students in these disciplines.
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