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Solder Joint Reliability - Theory and Applications (Paperback, Softcover reprint of the original 1st ed. 1991)
Loot Price: R5,872
Discovery Miles 58 720
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Solder Joint Reliability - Theory and Applications (Paperback, Softcover reprint of the original 1st ed. 1991)
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Solders have given the designer of modern consumer, commercial, and
military electronic systems a remarkable flexibility to
interconnect electronic components. The properties of solder have
facilitated broad assembly choices that have fueled creative
applications to advance technology. Solder is the electrical and me
chanical "glue" of electronic assemblies. This pervasive dependency
on solder has stimulated new interest in applica tions as well as a
more concerted effort to better understand materials properties. We
need not look far to see solder being used to interconnect ever
finer geo metries. Assembly of micropassive discrete devices that
are hardly visible to the unaided eye, of silicon chips directly to
ceramic and plastic substrates, and of very fine peripheral leaded
packages constitute a few of solder's uses. There has been a marked
increase in university research related to solder. New electronic
packaging centers stimulate applications, and materials engineering
and science departments have demonstrated a new vigor to improve
both the materials and our understanding of them. Industrial
research and development continues to stimulate new application,
and refreshing new packaging ideas are emerging. New handbooks have
been published to help both the neophyte and seasoned packaging
engineer.
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