Three-Dimensional Integration and Modeling - A Revolution in RF and Wireless Packaging (Paperback)

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References

General

Imprint:	Springer International Publishing AG
Country of origin:	Switzerland
Series:	Synthesis Lectures on Computational Electromagnetics
Release date:	December 2007
First published:	2008
Authors:	Jong Hoon Lee • Manos Tentzeris
Dimensions:	235 x 191mm (L x W)
Format:	Paperback
Pages:	108
ISBN-13:	978-3-03-100575-6
Languages:	English
Subtitles:	English
Categories:	Books > Professional & Technical > Technology: general issues > Engineering: general Books > Professional & Technical > Energy technology & engineering > Electrical engineering > General Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Microwave technology Promotions
LSN:	3-03-100575-9
Barcode:	9783031005756

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