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Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials
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Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research (Hardcover)
Loot Price: R4,530
Discovery Miles 45 300
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Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research (Hardcover)
Series: Wspc Series In Advanced Integration And Packaging, 3
Expected to ship within 10 - 15 working days
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To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique
volume is a collection of recent advances and emerging research
from various luminaries and experts in the field. Cutting-edge
technologies and research related to thermal management and thermal
packaging of micro- and nanoelectronics are covered, including
enhanced heat transfer, heat sinks, liquid cooling, phase change
materials, synthetic jets, computational heat transfer, electronics
reliability, 3D packaging, thermoelectrics, data centers, and solid
state lighting.This book can be used by researchers and
practitioners of thermal engineering to gain insight into next
generation thermal packaging solutions. It is an excellent
reference text for graduate-level courses in heat transfer and
electronics packaging.
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