0
Your cart

Your cart is empty

Books > Science & Mathematics > Chemistry > Physical chemistry

Buy Now

Contact Angle, Wettability and Adhesion, Volume 4 (Paperback) Loot Price: R1,904
Discovery Miles 19 040
Contact Angle, Wettability and Adhesion, Volume 4 (Paperback): Kash L. Mittal

Contact Angle, Wettability and Adhesion, Volume 4 (Paperback)

Kash L. Mittal

 (sign in to rate)
Loot Price R1,904 Discovery Miles 19 040 | Repayment Terms: R178 pm x 12*

Bookmark and Share

Expected to ship within 12 - 17 working days

This volume chronicles the proceedings of the 4th International Symposium on Contact Angle, Wettability and Adhesion held in Philadelphia, PA, June 2004. The world of wettability is very wide and it plays a crucial role in many and varied technological areas ranging from microfluidics to biomedical to agriculture to welding. This volume contains a total of 31 papers covering many ramifications of contact angle, wettability and adhesion. All manuscripts were rigorously peer-reviewed and revised, and properly edited before inclusion in this book. The topics covered include: fundamental aspects of contact line region; evaporative behavior of sessile drops; various factors influencing contact angle measurements; different kinds of contact angles; various ways to measure contact angles; contact angle hysteresis; contact angle measurements on various materials (smooth, rough, porous, heterogeneous); effect of electric field on contact angle (electrowetting); wetting and spreading on heterogeneous surfaces; factors influencing wetting/spreading phenomena; determination of solid surface free energy via contact angle measurements; application of AFM in determining solid surface tension at the nano-scale; ultralyophobic surfaces; surface modification and wettability; multiphase flow dynamics in porous media; thin film coatings for textile materials; bio-fouling resistant coatings; relationships between wetting and adhesion; and relevance/importance of wetting and surface energetics in technological applications, including cleaning of flooring materials, kinetics of oil removal from coating materials, cell adhesion, and mold compound- metal adhesion in semiconductor packaging.

General

Imprint: Crc Press
Country of origin: United Kingdom
Release date: December 2019
First published: 2006
Editors: Kash L. Mittal
Dimensions: 245 x 170mm (L x W)
Format: Paperback
Pages: 542
ISBN-13: 978-0-367-44632-1
Categories: Books > Science & Mathematics > Chemistry > Physical chemistry > General
LSN: 0-367-44632-4
Barcode: 9780367446321

Is the information for this product incomplete, wrong or inappropriate? Let us know about it.

Does this product have an incorrect or missing image? Send us a new image.

Is this product missing categories? Add more categories.

Review This Product

No reviews yet - be the first to create one!

Partners