High-Frequency Characterization of Electronic Packaging will be of
interest to researchers and designers of high-frequency electronic
packaging. Understanding high-frequency behavior of packaging is of
growing importance due to higher clock-speeds in computers and
higher data transmission rates in broadband telecommunication
systems. Basic knowledge of the high-frequency behavior of
packaging and interconnects is, therefore, indispensable for the
design of future telecommunication and computer systems.
High-Frequency Characterization of Electronic Packaging gives the
reader an insight into how high-frequency characterization of
electronic packaging should be done and describes the problems that
have to be tackled, especially in performing accurate measurements
on modern IC-packages and in determination of circuit models.
High-Frequency Characterization of Electronic Packaging is
conceived as a comprehensive guide for the start of research and to
help in performing high-frequency measurements. Important notions
in high- frequency characterization such as S-parameters,
calibration, probing, de-embedding and measurement-based modeling
are explained. The described techniques are illustrated with
several up-to-date examples.
General
Is the information for this product incomplete, wrong or inappropriate?
Let us know about it.
Does this product have an incorrect or missing image?
Send us a new image.
Is this product missing categories?
Add more categories.
Review This Product
No reviews yet - be the first to create one!
Welcome to Loot.co.za!
Sign in / Register |Wishlists & Gift Vouchers |Help | Advanced search
