Electromechanical Coupling Theory, Methodology and Applications for High-Performance Microwave Equipment (Hardcover)

Electromechanical Coupling Theory, Methodology and Applications for High-Performance Microwave Equipment Electromechanical Coupling Theory, Methodology, and Applications for High-Performance Microwave Equipment is an authoritative and up-to-date guide to the structural, mechanical, and electrical aspects of electromechanical coupling. Addressing control, electromagnetism, and structural engineering, this comprehensive reference covers the electromechanical coupling of high-performance microwave electronic equipment (MEE), such as antennas, radar, large radio telescopes, and telecommunication and navigation equipment. The book is divided into four main sections, beginning with an introduction to electromechanical coupling (EMC) theory and a detailed description of the multi-field coupling model (MFCM) and the influence mechanism (IM) of nonlinear factors of antenna-servo-feeder systems on performance. Subsequent sections discuss MFCM- and IM-based design methodology, EMC-based measurement and testing, computer software for coupling analysis and design of electronic equipment, and various engineering applications of EMC theory and the IM of typical electronic equipment. In addition, the book: Discusses information and data transfer in electromagnetic fields, mechanical and structural deformation fields, and temperature fields Explains how high-performance microwave electronic equipment differs from traditional mechanical equipment Addresses EMC-based and general design-vector based optimization of electronic equipment design Describes applications such as a gun-guided radar system for warships and a large-diameter antenna for moon exploration Includes evaluation criteria to validate MFCM/IM design theory and methodology Electromechanical Coupling Theory, Methodology, and Applications for High-Performance Microwave Equipment is essential reading for circuit designers, microwave engineers, researchers working with high-frequency microwave engineering, and engineers working with integrated circuits in radar, communications, IoT, antenna engineering, and remote sensing.

General

Imprint:	Wiley-Blackwell
Country of origin:	United States
Release date:	November 2022
First published:	2023
Authors:	B Duan
Dimensions:	250 x 150 x 15mm (L x W x T)
Format:	Hardcover
Pages:	336
ISBN-13:	978-1-119-90439-7
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Microwave technology Promotions
LSN:	1-119-90439-0
Barcode:	9781119904397

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