Managers, engineers and technicians will use this book during
industrial construction of electronics assemblies, whilst students
can use the book to get a grasp of the variety of methods
available, together with a discussion of technical concerns. It
includes over 200 illustrations, including a photographic guide to
defects, and contains many line drawings, tables and flow charts to
illustrate the subject of electronics assembly.
Soldering in Electronics Assembly looks theoretically at
everything needed in a detailed study, but in a practical manner.
It examines the soldering processes in the light of electronic
assembly type; solder; flux; and cleaning requirements. It has
information on every available process, from the most basic hand
soldering through to latest innovatory ones such as inert
atmosphere wave soldering and zoned forced convection infra-red
machines. The book provides a detailed analysis of solder and
soldering action; purpose of flux and relevant flux types for any
application; classification of assembly variants; assessment and
maintenance of solderability. There is also a detailed analysis of
soldering process defects and causes. In addition, Soldering in
Electronics Assembly contains a new chapter on Ball Grid Array
(BGA) technology.
Mike Judd is MD of Mike Judd Marketing and former MD of Electrovert
UK, Director of Marketing Europe for Electrovert, part of the
Cookson Group, and Director of OEM at Speedline.
Keith Brindley is a technical author with a wealth of experience of
all aspects of electronics technology.
- A practical guide for the industry covering all the main
soldering processes currently in use
- Cleaning, faults, troubleshooting and standards are all major
topics
- Considers safety and solder process quality assessment
General
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