Chemical-Mechanical Polishing 2000 - Fundamentals and Materials Issues: Volume 613 (Paperback)

Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. Other emerging applications for this technology include flat-panel displays, magnetic data storage and microelectromechanical systems. The rapid emergence of copper as the conducting material for integrated circuits has further pushed CMP technology to the forefront of semiconductor manufacturing. However, a basic understanding of the CMP process, which is necessary to enable further advances, is inadequate. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured. Topics include: CMP mechanisms; dielectric and metal CMP; process integration and manufacturability; and CMP consumables.

General

Imprint:	Cambridge UniversityPress
Country of origin:	United Kingdom
Series:	MRS Proceedings
Release date:	June 2014
First published:	April 2013
Editors:	Rajiv K. Singh • Rajeev Bajaj • Mansour Moinpour • Marc Meuris
Dimensions:	229 x 152 x 10mm (L x W x T)
Format:	Paperback - Trade
Pages:	176
ISBN-13:	978-1-107-41314-6
Categories:	Books > Professional & Technical > Industrial chemistry & manufacturing technologies > General Books > Professional & Technical > Mechanical engineering & materials > Materials science > General Promotions
LSN:	1-107-41314-1
Barcode:	9781107413146

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