Adhesion Aspects in MEMS/NEMS (Paperback)

Seong H. Kim, Michael T. Dugger, Kash L. Mittal

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Phenomena associated with the adhesion interaction of surfaces have been a critical aspect of micro- and nanosystem development and performance since the first MicroElectroMechanicalSystems(MEMS) were fabricated. These phenomena are ubiquitous in nature and are present in all systems, however MEMS devices are particularly sensitive to their effects owing to their small size and limited actuation force that can be generated. Extension of MEMS technology concepts to the nanoscale and development of NanoElectroMechanicalSystems(NEMS) will result in systems even more strongly influenced by surface forces. The book is divided into five parts as follows: Part 1: Understanding Through Continuum Theory; Part 2: Computer Simulation of Interfaces; Part 3: Adhesion and Friction Measurements; Part 4: Adhesion in Practical Applications; and Part 5: Adhesion Mitigation Strategies. This compilation constitutes the first book on this extremely important topic in the burgeoning field of MEMS/NEMS. It is obvious from the topics covered in this book that bountiful information is contained here covering understanding of surface forces and adhesion as well as novel ways to mitigate adhesion in MEMS/NEMS. This book should be of great interest to anyone engaged in the wonderful and fascinating field of MEMS/NEMS, as it captures the current R&D activity.

General

Imprint:	Crc Press
Country of origin:	United Kingdom
Release date:	December 2019
First published:	2010
Editors:	Seong H. Kim • Michael T. Dugger • Kash L. Mittal
Dimensions:	245 x 170mm (L x W)
Format:	Paperback
Pages:	410
ISBN-13:	978-0-367-44594-2
Categories:	Books > Science & Mathematics > Chemistry > Physical chemistry > General Promotions
LSN:	0-367-44594-8
Barcode:	9780367445942