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Fundamentals of Lead-Free Solder Interconnect Technology - From Microstructures to Reliability (Hardcover, 2015 ed.) Loot Price: R3,524
Discovery Miles 35 240
Repayment Terms: R330 pm x 12*
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Fundamentals of Lead-Free Solder Interconnect Technology - From Microstructures to Reliability (Hardcover, 2015 ed.): Tae-Kyu...

Fundamentals of Lead-Free Solder Interconnect Technology - From Microstructures to Reliability (Hardcover, 2015 ed.)

Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma

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Loot Price R3,524 Discovery Miles 35 240 | Repayment Terms: R330 pm x 12*

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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

General

Imprint: Springer-Verlag New York
Country of origin: United States
Release date: November 2014
First published: 2015
Authors: Tae-Kyu Lee • Thomas R. Bieler • Choong-Un Kim • Hongtao Ma
Dimensions: 235 x 155 x 16mm (L x W x T)
Format: Hardcover
Pages: 253
Edition: 2015 ed.
ISBN-13: 978-1-4614-9265-8
Categories: Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
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LSN: 1-4614-9265-3
Barcode: 9781461492658

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