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Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials

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Fundamentals of Lead-Free Solder Interconnect Technology - From Microstructures to Reliability (Hardcover, 2015 ed.) Loot Price: R3,615

Discovery Miles 36 150

Repayment Terms: R339 pm x 12*

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Fundamentals of Lead-Free Solder Interconnect Technology - From Microstructures to Reliability (Hardcover, 2015 ed.): Tae-Kyu...

Fundamentals of Lead-Free Solder Interconnect Technology - From Microstructures to Reliability (Hardcover, 2015 ed.)

Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma

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Loot Price R3,615 Discovery Miles 36 150 | Repayment Terms: R339 pm x 12*

Expected to ship within 12 - 19 working days

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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

General

Imprint:	Springer-Verlag New York
Country of origin:	United States
Release date:	November 2014
First published:	2015
Authors:	Tae-Kyu Lee • Thomas R. Bieler • Choong-Un Kim • Hongtao Ma
Dimensions:	235 x 155 x 16mm (L x W x T)
Format:	Hardcover
Pages:	253
Edition:	2015 ed.
ISBN-13:	978-1-4614-9265-8
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General Promotions
LSN:	1-4614-9265-3
Barcode:	9781461492658