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Reliability, Yield, and Stress Burn-In - A Unified Approach for Microelectronics Systems Manufacturing & Software Development (Hardcover, 1998 ed.)
Loot Price: R4,823
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Reliability, Yield, and Stress Burn-In - A Unified Approach for Microelectronics Systems Manufacturing & Software Development (Hardcover, 1998 ed.)
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Reliability, Yield, and Stress Burn-In explains reliability issues
in Microelectronics Systems Manufacturing and Software Development
with an emphasis on evolving manufacturing technology for the
semiconductor industry. Since most microelectronics components have
an infant mortality period of about one year under ordinary
operating conditions, and many modern systems, such as PCs, are
heavily used in the first few years, the reliability problem in the
infant mortality period becomes extremely important. Burn-in is an
accelerated screening procedure that eliminates infant mortalities
early on in the shop before shipping out the products to the
customers. This book will also help readers to analyze systems that
exhibit high failure rate during a long infant mortality period.
Reliability, Yield, and Stress Burn-In presents ways to
systematically analyze burn-in policy at the component, sub-system,
and system levels. Various statistical methods are addressed
including parametric, nonparametric, and Bayesian approaches. Many
case studies are introduced in combination with the developed
theories. Included in the book is an introduction to software
reliability. Reliability, Yield, and Stress Burn-In will help
manufacturers and system designers to understand and to design a
more reliable product given constraints specified by the users and
designers. An understanding of the infant mortality period will
solve many reliability problems, including those faced in the
semiconductor industry and software industry.
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