Modeling and Application of Flexible Electronics Packaging (Hardcover, 1st ed. 2019)

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.

General

Imprint:	Springer Verlag, Singapore
Country of origin:	Singapore
Release date:	May 2019
First published:	2019
Authors:	Yongan Huang • Zhouping Yin • Xiaodong Wan
Dimensions:	235 x 155mm (L x W)
Format:	Hardcover
Pages:	287
Edition:	1st ed. 2019
ISBN-13:	978-981-13-3626-3
Categories:	Books > Computing & IT > Applications of computing > Computer modelling & simulation Books > Professional & Technical > Mechanical engineering & materials > Production engineering > General Books > Professional & Technical > Mechanical engineering & materials > Materials science > Mechanics of solids > General Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
LSN:	981-13-3626-1
Barcode:	9789811336263

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