In semiconductor manufacturing, understanding how various materials
behave and interact is critical to making a reliable and robust
semiconductor package. Semiconductor Packaging: Materials
Interaction and Reliability provides a fundamental understanding of
the underlying physical properties of the materials used in a
semiconductor package. The book focuses on an important step in
semiconductor manufacturing-package assembly and testing. It covers
the basics of material properties and explains how to determine
which behaviors are important to package performance. The authors
also discuss how the properties of packaging materials interact
with each another and explore how to maximize the performance of
these materials in regard to package integrity and reliability. By
tying together the disparate elements essential to a semiconductor
package, this easy-to-read book shows how all the parts fit and
work together to provide durable protection for the integrated
circuit chip within as well as a means for the chip to communicate
with the outside world.
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