Electronic materials are the actual semiconductors, plastics,
metals and ceramics that make up the chips and packages from which
we construct todays cell phones, palmtops, and PDAs. The switch in
applications from PCs to smaller communications devices has driven
the micro-miniaturization trend in electronics, which in turn has
created a new set of challenges in creating materials to meet their
specifications. This new edition, the first update of the handbook
since 1993, is a complete rewrite, reflecting the great importance
of engineering materials for thermal management and flexibility and
micro-miniature sizes. This new handbook will be an invaluable tool
to anyone working electronic packaging, fabrication, or assembly
design.
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