CoolerMaster HTK High Performance Thermal Compound

Grease-like silicone materials, heavily filled with heat conductive

metal oxides. This combination promotes high thermal conductivity, low

bleed and high-temperature stability. These compounds resist changes in

consistency at temperatures up to 177 C (350 F), maintaining a positive

heat sink seal to improve heat transfer from the electronic device to

the heat sink or chassis, thereby, increasing the overall efficiency of

the device.

General

Physical Specification

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• Suitable for CPU, chipsets on Mainboard, VGA card, etc.
• Easy to use
• Zif Socket Templates ensure correct applying area with various

  CPU socket types.

• Produces an even layer when using applicator.
• Dielectric.
• Wide range of application temperature

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