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Low Power Methodology Manual - For System-on-Chip Design (Hardcover, 1st ed. 2007. Corr. 2nd printing 2007) Loot Price: R5,445
Discovery Miles 54 450
Low Power Methodology Manual - For System-on-Chip Design (Hardcover, 1st ed. 2007. Corr. 2nd printing 2007): David Flynn, Rob...

Low Power Methodology Manual - For System-on-Chip Design (Hardcover, 1st ed. 2007. Corr. 2nd printing 2007)

David Flynn, Rob Aitken, Alan Gibbons, Kaijian Shi

Series: Integrated Circuits and Systems

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Loot Price R5,445 Discovery Miles 54 450 | Repayment Terms: R510 pm x 12*

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?Tools alone aren't enough to reduce dynamic and leakage power in complex chip designs - a well-planned methodology is needed. Following in the footsteps of the successful Reuse Methodology Manual (RMM), authors from ARM and Synopsys have written this Low Power Methodology Manual (LPMM) to describe such] a] low-power methodology with a practical, step-by-step approach.? Richard Goering, Software Editor, EE Times ?Excellent compendium of low-power techniques and guidelines with balanced content spanning theory and practical implementation. The LPMM is a very welcome addition to the field of low power SoC implementation that has for many years operated in a largely ad-hoc fashion.? Sujeeth Joseph, Chief Architect - Semiconductor and Systems Solutions Unit, Wipro Technologies ?The LPMM enables broader adoption of aggressive power management techniques based on extensive experience and silicon example with real data that every SOC designer can use to meet the difficulties faced in managing the power issues in deep submicron designs.? Anil Mankar, Sr VP Worldwide Core Engineering and Chief Development Officer, Conexant Systems Inc. ?Managing power, at 90nm and below, introduces significant challenges to design flow. The LPMM is a timely and immediately useful book that shows how combination of tools, IP and methodology can be used together to address power management.? Nick Salter, Head of Chip Integration, CSR plc.

General

Imprint: Springer-Verlag New York
Country of origin: United States
Series: Integrated Circuits and Systems
Release date: December 2007
First published: 2007
Authors: David Flynn • Rob Aitken • Alan Gibbons • Kaijian Shi
Dimensions: 235 x 155 x 19mm (L x W x T)
Format: Hardcover
Pages: 300
Edition: 1st ed. 2007. Corr. 2nd printing 2007
ISBN-13: 978-0-387-71818-7
Categories: Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
LSN: 0-387-71818-4
Barcode: 9780387718187

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