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Thermal Testing of Integrated Circuits (Hardcover, 2002 ed.)
Loot Price: R2,975
Discovery Miles 29 750
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Thermal Testing of Integrated Circuits (Hardcover, 2002 ed.)
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Temperature has been always considered as an appreciable magnitude
to detect failures in electric systems. Abnormal status of this
variable, both too high and too low, is sign of abnormal behavior
in electronic systems. In Thermal Testing of Integrated Circuits
the authors present the feasibility to consider temperature as an
observable for testing purposes. The coupling of circuits through
heat is inherent to the solid-state nature and the inspection of
temperature does not interact with Under Test Circuits or Systems,
something that does not happen when voltage or current observable
are used. In the book the basis of heat propagation, heat
conducting mechanisms and temperature sensitivity of semiconductors
are focused with a full coverage of the state of the art. We
usually have the idea that all the heating processes are slow,
which is true in the macroscopic world, but is not in the case of
integrated circuits where the reduced size and amount of material
and the really high conductivity of substrates make the thermal
testing a promising technique. CMOS and BICMOS temperature sensors
for built-in thermal testing are presented in the book. The
application of temperature as testing magnitude for both on-line
and off-line, analog or digital, on-chip or off-chip are
considered. The temperature sensing has an inherent directional
capability that can be used as an element for localizing failures,
so the technique has interesting diagnosis capabilities as well.
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