Bonding in Microsystem Technology (Hardcover)

This volume starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author's personal experience.

General

Imprint:	Springer-Verlag New York
Country of origin:	United States
Series:	Springer Series in Advanced Microelectronics, 24
Release date:	June 2006
First published:	2006
Authors:	Jan A Dziuban
Dimensions:	235 x 156 x 20mm (L x W x T)
Format:	Hardcover
Pages:	334
ISBN-13:	978-1-4020-4578-3
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > General Promotions
LSN:	1-4020-4578-6
Barcode:	9781402045783

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