Reliability of Microtechnology - Interconnects, Devices and Systems (Paperback, 2011 ed.)

Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also includes exercises and detailed solutions at the end of each chapter.

General

Imprint:	Springer-Verlag New York
Country of origin:	United States
Release date:	October 2014
First published:	2010
Authors:	Johan Liu • Olli Salmela • Jussi Sarkka • James E. Morris • Per-Erik Tegehall • Cristina Andersson
Dimensions:	235 x 155 x 12mm (L x W x T)
Format:	Paperback
Pages:	204
Edition:	2011 ed.
ISBN-13:	978-1-4899-8211-7
Categories:	Books > Professional & Technical > Mechanical engineering & materials > Production engineering > Reliability engineering Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > General Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Other manufacturing technologies > Precision instruments manufacture > General
LSN:	1-4899-8211-6
Barcode:	9781489982117

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