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Books > Professional & Technical > Electronics & communications engineering
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Through-Silicon Vias for 3D Integration (Hardcover, Ed)
Loot Price: R4,287
Discovery Miles 42 870
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Through-Silicon Vias for 3D Integration (Hardcover, Ed)
Expected to ship within 18 - 22 working days
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Publisher's Note: Products purchased from Third Party sellers are
not guaranteed by the publisher for quality, authenticity, or
access to any online entitlements included with the product. A
comprehensive guide to TSV and other enabling technologies for 3D
integrationWritten by an expert with more than 30 years of
experience in the electronics industry, Through-Silicon Vias for 3D
Integration provides cutting-edgeinformation on TSV, wafer
thinning, thin-wafer handling, microbumping and assembly, and
thermal management technologies. Applications to highperformance,
high-density, low-power-consumption, wide-bandwidth, and
small-form-factor electronic products are discussed. This book
offers a timely summary of progress in all aspects of this
fascinating field for professionals active in 3D integration
research and development, those who wish to master 3D integration
problem-solving methods, and anyone in need of a low-power,
wide-bandwidth design and high-yield manufacturing process for
interconnect systems. Coverage includes: Nanotechnology and 3D
integration for the semiconductor industry TSV etching,
dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP,
and Cu revealing TSVs: mechanical, thermal, and electrical
behaviors Thin-wafer strength measurement Wafer thinning and
thin-wafer handling Microbumping, assembly, and reliability
Microbump electromigration Transient liquid-phase bonding: C2C,
C2W, and W2W 2.5D IC integration with interposers 3D IC integration
with interposers Thermal management of 3D IC integration 3D IC
packaging
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