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Books > Professional & Technical > Electronics & communications engineering > Electronics engineering

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Area Array Packaging Processes (Paperback) Loot Price: R3,380
Discovery Miles 33 800
Repayment Terms: R317 pm x 12*
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Area Array Packaging Processes (Paperback): Ken Gilleo

Area Array Packaging Processes (Paperback)

Ken Gilleo

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Loot Price R3,380 Discovery Miles 33 800 | Repayment Terms: R317 pm x 12*

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This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.

General

Imprint: McGraw-Hill Professional
Country of origin: United States
Release date: October 2003
First published: October 2003
Authors: Ken Gilleo
Dimensions: 191 x 235 x 14mm (L x W x T)
Format: Paperback - Trade
Pages: 272
ISBN-13: 978-0-07-173801-9
Categories: Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > General
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LSN: 0-07-173801-0
Barcode: 9780071738019

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