Solder Materials (Hardcover)

This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials.

General

Imprint:	World Scientific Publishing Co Pte Ltd
Country of origin:	Singapore
Series:	Wspc Series In Advanced Integration And Packaging, 6
Release date:	September 2018
First published:	2018
Authors:	Kwang-lung Lin
Format:	Hardcover
Pages:	388
ISBN-13:	978-981-3237-60-5
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > Semi-conductors & super-conductors
LSN:	981-3237-60-0
Barcode:	9789813237605

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