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Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > Semi-conductors & super-conductors
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Design And Modeling For 3d Ics And Interposers (Hardcover)
Loot Price: R3,303
Discovery Miles 33 030
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Design And Modeling For 3d Ics And Interposers (Hardcover)
Series: Wspc Series In Advanced Integration And Packaging, 2
Expected to ship within 18 - 22 working days
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3D Integration is being touted as the next semiconductor
revolution. This book provides a comprehensive coverage on the
design and modeling aspects of 3D integration, in particularly,
focus on its electrical behavior. Looking from the perspective the
Silicon Via (TSV) and Glass Via (TGV) technology, the book
introduces 3DICs and Interposers as a technology, and presents its
application in numerical modeling, signal integrity, power
integrity and thermal integrity. The authors underscored the
potential of this technology in design exchange formats and power
distribution.
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