|
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > Semi-conductors & super-conductors
|
Buy Now
Design And Modeling For 3d Ics And Interposers (Hardcover)
Loot Price: R3,580
Discovery Miles 35 800
|
|
|
Design And Modeling For 3d Ics And Interposers (Hardcover)
Series: Wspc Series In Advanced Integration And Packaging, 2
Expected to ship within 10 - 15 working days
|
3D Integration is being touted as the next semiconductor
revolution. This book provides a comprehensive coverage on the
design and modeling aspects of 3D integration, in particularly,
focus on its electrical behavior. Looking from the perspective the
Silicon Via (TSV) and Glass Via (TGV) technology, the book
introduces 3DICs and Interposers as a technology, and presents its
application in numerical modeling, signal integrity, power
integrity and thermal integrity. The authors underscored the
potential of this technology in design exchange formats and power
distribution.
General
Is the information for this product incomplete, wrong or inappropriate?
Let us know about it.
Does this product have an incorrect or missing image?
Send us a new image.
Is this product missing categories?
Add more categories.
Review This Product
No reviews yet - be the first to create one!
|
You might also like..
|
Email address subscribed successfully.
A activation email has been sent to you.
Please click the link in that email to activate your subscription.
Welcome to Loot.co.za!
Sign in / Register |Wishlists & Gift Vouchers |Help | Advanced search
