VLSI-SOC: From Systems to Chips - IFIP TC 10/WG 10.5, Twelfth International Conference on Very Large Scale Ingegration of System on Chip (VLSI-SoC 2003), December 1-3, 2003, Darmstadt, Germany (Hardcover, and ed.)

This book contains extended and revised versions of the best papers that have been presented during the twelfth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a Global System-on-a-Chip Design & CAD Conference. The 12* edition was held at the Lufthansa Training Center in Seeheim-Jugenheim, south of Darmstadt, Germany (December 1-3, 2003). Previous conferences have taken place in Edinburgh (81), Trondheim (83), Tokyo (85), Vancouver (87), Munich (89), Edinburgh (91), Grenoble (93), Tokyo (95), Gramado (97), Lisbon (99)andMontpellier(01). The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5, is to provide a forum to exchange ideas and show research results in the field of microelectronics design. The current trend toward increasing chip integration brings about exhilarating new challenges both at the physical and system-design levels: this conference aims to address these exciting new issues. The 2003 edition of VLSI-SoC conserved the traditional structure, which has been successful in previous editions. The quality of submissions (142 papers) made the selection process difficult, but finally 57 papers and 14 posters were accepted for presentation in VLSI-SoC 2003. Submissions came from Austria, Bulgaria, Brazil, Canada, Egypt, England, Estonia, Finland, France, Germany, Greece, Hungary, India, Iran, Israel, Italy, Japan, Korea, Malaysia, Mexico, Netherlands, Poland, Portugal, Romania, Spain, Sweden, Taiwan and the United States of America. From 57 papers presented at the conference, 18 were selected to have an extended and revised version included in this book.

General

Imprint:	Springer-Verlag New York
Country of origin:	United States
Series:	IFIP Advances in Information and Communication Technology, 200
Release date:	May 2006
First published:	2006
Editors:	Manfred Glesner • Ricardo Reis • Leandro Indrusiak • Vincent Mooney • Hans Eveking
Dimensions:	235 x 155 x 19mm (L x W x T)
Format:	Hardcover
Pages:	314
Edition:	and ed.
ISBN-13:	978-0-387-33402-8
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Promotions
LSN:	0-387-33402-5
Barcode:	9780387334028

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