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Books > Computing & IT > Applications of computing > Artificial intelligence > Knowledge-based systems / expert systems

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Electrical Design of Through Silicon Via (Hardcover, 2014 ed.) Loot Price: R2,903

Discovery Miles 29 030

Repayment Terms: R272 pm x 12*

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Electrical Design of Through Silicon Via (Hardcover, 2014 ed.): Manho Lee, Jun So Pak, Joungho Kim

Electrical Design of Through Silicon Via (Hardcover, 2014 ed.)

Manho Lee, Jun So Pak, Joungho Kim

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Loot Price R2,903 Discovery Miles 29 030 | Repayment Terms: R272 pm x 12*

Expected to ship within 10 - 15 working days

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Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep intoTSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered."

General

Imprint:	Springer
Country of origin:	Netherlands
Release date:	May 2014
First published:	2014
Editors:	Manho Lee • Jun So Pak • Joungho Kim
Dimensions:	235 x 155 x 20mm (L x W x T)
Format:	Hardcover
Pages:	280
Edition:	2014 ed.
ISBN-13:	978-9401790376
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Computing & IT > Applications of computing > Artificial intelligence > Knowledge-based systems / expert systems Promotions
LSN:	940179037X
Barcode:	9789401790376