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Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > Semi-conductors & super-conductors

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Wafer Bonding - Applications and Technology (Hardcover, 2004 ed.) Loot Price: R8,871
Discovery Miles 88 710
Repayment Terms: R831 pm x 12*
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Wafer Bonding - Applications and Technology (Hardcover, 2004 ed.): Marin Alexe, Ulrich Goesele

Wafer Bonding - Applications and Technology (Hardcover, 2004 ed.)

Marin Alexe, Ulrich Goesele

Series: Springer Series in Materials Science, 75

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Loot Price R8,871 Discovery Miles 88 710 | Repayment Terms: R831 pm x 12*

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The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

General

Imprint: Springer-Verlag
Country of origin: Germany
Series: Springer Series in Materials Science, 75
Release date: May 2004
First published: 2004
Editors: Marin Alexe • Ulrich Goesele
Dimensions: 235 x 155 x 33mm (L x W x T)
Format: Hardcover
Pages: 504
Edition: 2004 ed.
ISBN-13: 978-3-540-21049-8
Categories: Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > Semi-conductors & super-conductors
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LSN: 3-540-21049-0
Barcode: 9783540210498

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