The topics include bonding-based fabrication methods of
silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs,
MEMS together with hybrid integration and laser lift-off. The
non-specialist will learn about the basics of wafer bonding and its
various application areas, while the researcher in the field will
find up-to-date information about this fast-moving area, including
relevant patent information.
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