The industry of electronic packaging is fast moving towards
lead-free solders because of environmental and health concerns.
Among the various surface finishes available, electroless nickel/
immersion gold (ENIG) is the most appealing at the moment.
Unfortunately, the presence of phosphorus (P) may complicate the
interfacial reactions and may affect the reliability of the solder
joint. In order to minimise this problem, an alternative surface
finish were introduced, in which a layer of palladium is introduced
between the nickel and gold layers using electroless deposition.
This book explores this question in detail with the effect of
annealing and aging of Sn-37Pb eutectic solder and Sn-4Ag-0.5Cu
solder on ENIG and ENEPIG surface finishes. Other parameters
involved are P content in Ni layer and the Ni layer thickness. The
intermetallics (IMC) were characterized in terms of thickness,
morphology and composition.
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