Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces (Paperback, Softcover reprint of the original 1st ed. 2016)

This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.

General

Imprint:	Springer-Verlag
Country of origin:	Germany
Series:	Springer Theses
Release date:	August 2016
First published:	2016
Authors:	Qingke Zhang
Dimensions:	235 x 155mm (L x W)
Format:	Paperback
Pages:	143
Edition:	Softcover reprint of the original 1st ed. 2016
ISBN-13:	978-3-662-51725-3
Categories:	Books > Science & Mathematics > Physics > Classical mechanics > General Books > Professional & Technical > Mechanical engineering & materials > Materials science > Mechanics of solids > General Books > Professional & Technical > Mechanical engineering & materials > Materials science > Testing of materials > General
LSN:	3-662-51725-6
Barcode:	9783662517253

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