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Microelectronics Packaging Handbook - Subsystem Packaging Part III (Hardcover, 2nd ed. 1997)
Loot Price: R4,976
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Microelectronics Packaging Handbook - Subsystem Packaging Part III (Hardcover, 2nd ed. 1997)
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This thoroughly revised and updated three volume set continues to
be the standard reference in the field, providing the latest in
microelectronics design methods, modeling tools, simulation
techniques, and manufacturing procedures. Unlike reference books
that focus only on a few aspects of microelectronics packaging,
these outstanding volumes discuss state-of-the-art packages that
meet the power, cooling, protection, and interconnection
requirements of increasingly dense and fast microcircuitry.
Providing an excellent balance of theory and practical
applications, this dynamic compilation features step-by-step
examples and vital technical data, simplifying each phase of
package design and production. In addition, the volumes contain
over 2000 references, 900 figures, and 250 tables. Part I:
Technology Drivers covers the driving force of microelectronics
packaging - electrical, thermal, and reliability. It introduces the
technology developer to aspects of manufacturing that must be
considered during product development. Part II: Semiconductor
Packaging discusses the interconnection of the IC chip to the first
level of packaging and all first level packages. Electrical test,
sealing, and encapsulation technologies are also covered in detail.
Part III: Subsystem Packaging explores board level packaging as
well as connectors, cables, and optical packaging.
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