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Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition (Hardcover, 2nd edition)
Loot Price: R6,089
Discovery Miles 60 890
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Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition (Hardcover, 2nd edition)
Expected to ship within 10 - 15 working days
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A fully updated, comprehensive guide to electronic packaging
technologies This thoroughly revised resource offers rigorous and
complete coverage of microsystems packaging at both the device and
system level. You will get in-depth guidance on the latest
technologies from academic and industry leaders. New chapters cover
topics highly relevant to today's small and ultra-small systems.
Fundamentals of Microsystems Packaging, Second Edition, discusses
the entire field, from wafer to systems, and clearly explains every
major contributing technology. The book details emerging systems,
including smart wearables, the Internet of Things, bioelectronics
for medical applications, cloud computing, and much more.
Microelectronics, photonics, MEMS, sensors, RF, and wireless
technologies are fully covered. * Covers the electrical,
mechanical, chemical, and materials aspects of each technology *
Contains examples of all common configurations and technologies *
Written by the leading author in the field
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