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System-on-Package (SOP) is an emerging microelectronic technology
that places an entire system on a single chip-size package. Where
"systems" used to be bulky boxes housing hundreds of components,
SOP saves interconnection time and heat generation by keep a full
system with computing, communications, and consumer functions all
in a single chip. Written by the Georgia Tech developers of the
technology, this book explains the basic parameters, design
functions, and manufacturing issues, showing electronic designers
how this radical new packaging technology can be used to solve
pressing electronics design challenges.
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