Thermal design in electronics cooling is to achieve effective heat
removal to increase reliability and life of the components and
systems. This book focuses on cooling of a Flip Chip (FC) package
without the use of phase change materials(PCM). A numerical thermal
model was developed and validated. CFD Simulation is performed for
PCM and non-PCM based material studies. Relevant thermal
performance data were obtained to show the effects of thermal
interface material, lid, heat sink and process variables. Excellent
agreement found between the numerical and the measured data. A
novel PCM-based passive thermal control of electronic devices was
investigated experimentally. A tall enclosure with uniform/discrete
heat sources applied on sides for PCM melting and another with a
PCM-filled heat sink setup developed and tested. PCM-based cooling
technique is attractive thermal concept for transient applications.
Effects of various parameters on melting/freezing times were
studied. Flow visualization experiments were also made to determine
the PCM melting rates. Finally, a 2D numerical study was conducted
to compare simulation results with experimental data.
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