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Micro-Assembly Technologies and Applications - IFIP TC5 WG5.5 Fourth International Precision Assembly Seminar (IPAS'2008) Chamonix, France, February 10-13, 2008 (Hardcover, 2008 ed.) Loot Price: R2,857
Discovery Miles 28 570
Micro-Assembly Technologies and Applications - IFIP TC5 WG5.5 Fourth International Precision Assembly Seminar (IPAS'2008)...

Micro-Assembly Technologies and Applications - IFIP TC5 WG5.5 Fourth International Precision Assembly Seminar (IPAS'2008) Chamonix, France, February 10-13, 2008 (Hardcover, 2008 ed.)

Sandra Koelemeijer; Edited by Svetan Ratchev

Series: IFIP Advances in Information and Communication Technology, 260

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Loot Price R2,857 Discovery Miles 28 570 | Repayment Terms: R268 pm x 12*

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Micro-assembly is a key enabling technology for cost effective manufacture of new generations of complex micro products. It is also a critical technology for retaining mdustrial capabilities in high labour cost areas such as Europe since up to 80% of the production cost in some industries is attributed directly to assembly processes. With the continuous trend for product miniaturisation, the scientific and technologi cal developments in micro-assembly are expected to have a significant long-term economic, demographic and social impact. A distinctive feature of the process is that surface forces are often dominant over gravity forces, which determines a number of specific technical challenges. Critical areas which are currently being addressed include development of assembly systems with high positional accuracy, micro gripping methods that take into ac count the adhesive surface forces, high precision micro-feeding techniques and mi cro-joining processes. Micro-assembly has developed rapidly over the last few years and all the pre dictions are that it will remain a critical technology for high value products in a number of key sectors such as healthcare, communications, defence and aerospace. The key challenge is to match the significant technological developments with a new generation of micro products that will establish firmly micro-assembly as a core manufacturing process."

General

Imprint: Springer-Verlag New York
Country of origin: United States
Series: IFIP Advances in Information and Communication Technology, 260
Release date: 2008
First published: 2008
Associate editors: Sandra Koelemeijer
Editors: Svetan Ratchev
Dimensions: 235 x 155 x 23mm (L x W x T)
Format: Hardcover
Pages: 416
Edition: 2008 ed.
ISBN-13: 978-0-387-77402-2
Categories: Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
LSN: 0-387-77402-5
Barcode: 9780387774022

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