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Heat Management in Integrated Circuits - On-chip and system-level monitoring and cooling (Hardcover)
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Heat Management in Integrated Circuits - On-chip and system-level monitoring and cooling (Hardcover)
Series: Materials, Circuits and Devices
Expected to ship within 10 - 15 working days
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As integrated circuits get smaller and more complex, power
densities are increasing, leading to more heat generation. Dealing
with this heat is fast becoming the most important design
bottleneck of current and future integrated circuits, where power
envelopes are defined by the ability of the system to dissipate the
generated heat. Thermal effects are forcing chip designers to apply
conservative design margins, creating sub-optimal results. At a
larger scale, cooling is the second most costly item in the
electricity bills of well-designed high-performance computing and
data centers, costing 30-50% of the total. Thermal monitoring and
management in integrated circuits is therefore becoming
increasingly important. This book covers thermal monitoring and
management in integrated circuits, with a focus on devices and
materials that are intimately integrated on-chip as opposed to
in-package or on-board. The devices and circuits discussed include
various designs used for the purpose of converting temperature to a
digital measurement and actively biased circuits that reverse
thermal gradients on chips for the purpose of cooling. Topics
covered include an overview of heat in integrated circuits and
systems, on-chip temperature sensing, dynamic thermal management,
active cooling, and mitigating thermal events at the system-level
and above.
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