Electronic Packaging Materials and Their Properties (Hardcover)

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: -interconnections -printed circuit boards -substrates -encapsulants -dielectrics -die attach materials -electrical contacts -thermal materials -solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

General

Imprint:	Crc Press
Country of origin:	United States
Series:	Electronic Packaging
Release date:	December 1998
First published:	1998
Authors:	Sirus Javadpour • Rahul Mahajan • Michael Pecht • Rakish Agarwal • F. Patrick McCluskey • Terrance J. Dishongh
Dimensions:	234 x 156 x 12mm (L x W x T)
Format:	Hardcover
Pages:	128
ISBN-13:	978-0-8493-9625-0
Categories:	Books > Professional & Technical > Electronics & communications engineering > General Promotions
LSN:	0-8493-9625-5
Barcode:	9780849396250

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