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Precision Assembly Technologies for Mini and Micro Products - Proceedings of the IFIP TC5 WG5.5 Third International Precision Assembly Seminar (IPAS'2006), 19-21 February 2006, Bad Hofgastein, Austria (Hardcover, 2006 ed.) Loot Price: R2,990
Discovery Miles 29 900
Precision Assembly Technologies for Mini and Micro Products - Proceedings of the IFIP TC5 WG5.5 Third International Precision...

Precision Assembly Technologies for Mini and Micro Products - Proceedings of the IFIP TC5 WG5.5 Third International Precision Assembly Seminar (IPAS'2006), 19-21 February 2006, Bad Hofgastein, Austria (Hardcover, 2006 ed.)

Svetan Ratchev

Series: IFIP Advances in Information and Communication Technology, 198

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Loot Price R2,990 Discovery Miles 29 900 | Repayment Terms: R280 pm x 12*

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Customers increasingly expect products that are smaller, have improved functionality and reliabiltiy, and cost less. Minaturization and integration of mechanical, sensing, and control functions within confined spaces is becoming an important trend in designing new products in the automotive, biomedical, pharaceutical and telecommunications industries in particular.

The International Precision Assembly Seminar (IPAS) is a premier international forum for reporting and discussing key technological developments in the field of mini and micro assembly automation. The contributions to the 3rd IPAS'2006 seminar have been grouped into 6 sections. Part 1 deals with new techniques for the handling and feeding of micro parts. Micro-robotics and robot applications for micro assembly are discussed in Part 2. An overview of different design and planning applications for microassembly is provided in Part 3. Part 4 is dedicated to reconfigurable and modular micro assembly systems and control applications. The economic aspects of microassembly including new business models are discussed in Part 5 while Part 6 presents specific technical solutions and microassembly applications.

General

Imprint: Springer-Verlag New York
Country of origin: United States
Series: IFIP Advances in Information and Communication Technology, 198
Release date: 2006
First published: 2006
Editors: Svetan Ratchev
Dimensions: 235 x 155 x 20mm (L x W x T)
Format: Hardcover
Pages: 336
Edition: 2006 ed.
ISBN-13: 978-0-387-31276-7
Categories: Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
LSN: 0-387-31276-5
Barcode: 9780387312767

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