Wireless Interface Technologies for 3D IC and Module Integration (Hardcover)

Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.

General

Imprint:	Cambridge UniversityPress
Country of origin:	United Kingdom
Release date:	September 2021
Authors:	Tadahiro Kuroda • Wai-Yeung Yip
Dimensions:	251 x 177 x 24mm (L x W x T)
Format:	Hardcover
Pages:	300
ISBN-13:	978-1-108-84121-4
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Promotions
LSN:	1-108-84121-X
Barcode:	9781108841214

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