The Electronic Device Failure Analysis Society proudly announces
the Seventh Edition of the Microelectronics Failure Analysis Desk
Reference, published by ASM International. The new edition will
help engineers improve their ability to verify, isolate, uncover,
and identify the root cause of failures. Prepared by a team of
experts, this updated reference offers the latest information on
advanced failure analysis tools and techniques, illustrated with
numerous real-life examples. Topics include: Failure Analysis
Process and Management-wafer, package, and board level failure
analysis flow. Incoming Inspection Tools-optical, x-ray, and
scanning acoustic microscopy. Fault Isolation-front and backside
sample prepara tion, CAD navigation, laser-assisted device
alteration (LADA), soft defect location (SDL), lock-in thermog
raphy, laser voltage probing (LVP), photon emission, EOTPR/TDR/TDT,
and current imaging. Device and Circuit Characterization-scanning
electron microscopy (SEM)-based and atomic force microscopy
(AFM)-based nanoprobing. FIB Technique and Circuit Edit- FIB
overview and advanced circuit edit for first silicon debug.
Physical Analysis-deprocessing, cross section analysis, scanning
electron microscopy, material analysis techniques, transmission
electron micros copy (TEM), and scanning probe microscopy. Memory
FA-DRAM, semiconductor memory failure signature analysis. Special
Applications-automotive FA, 2.5 and 3D packaging failure analysis,
microelectromechanical systems (MEMS), optoelectronics, solar, and
counterfeit electronics. Fundamental Topics-integrated circuit
testing, analog design, reliability, quality, and training. Seven
new topics have been added and all themes covered in earlier
editions are included in the Seventh Edition. Many previous
articles have been updated.
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