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Reliability, Yield, and Stress Burn-In - A Unified Approach for Microelectronics Systems Manufacturing & Software Development (Paperback, Softcover reprint of the original 1st ed. 1998)
Loot Price: R4,613
Discovery Miles 46 130
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Reliability, Yield, and Stress Burn-In - A Unified Approach for Microelectronics Systems Manufacturing & Software Development (Paperback, Softcover reprint of the original 1st ed. 1998)
Expected to ship within 10 - 15 working days
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The international market is very competitive for high-tech
manufacturers to day. Achieving competitive quality and reliability
for products requires leader ship from the top, good management
practices, effective and efficient operation and maintenance
systems, and use of appropriate up-to-date engineering de sign
tools and methods. Furthermore, manufacturing yield and reliability
are interrelated. Manufacturing yield depends on the number of
defects found dur ing both the manufacturing process and the
warranty period, which in turn determines the reliability. the
production of microelectronics has evolved into Since the early
1970's, one of the world's largest manufacturing industries. As a
result, an important agenda is the study of reliability issues in
fabricating microelectronic products and consequently the systems
that employ these products, particularly, the new generation of
microelectronics. Such an agenda should include: * the economic
impact of employing the microelectronics fabricated by in dustry, *
a study of the relationship between reliability and yield, * the
progression toward miniaturization and higher reliability, and *
the correctness and complexity of new system designs, which include
a very significant portion of software.
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