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Reliability, Yield, and Stress Burn-In - A Unified Approach for Microelectronics Systems Manufacturing & Software Development (Paperback, Softcover reprint of the original 1st ed. 1998) Loot Price: R4,613
Discovery Miles 46 130
Reliability, Yield, and Stress Burn-In - A Unified Approach for Microelectronics Systems Manufacturing & Software Development...

Reliability, Yield, and Stress Burn-In - A Unified Approach for Microelectronics Systems Manufacturing & Software Development (Paperback, Softcover reprint of the original 1st ed. 1998)

Way Kuo, Wei-Ting Kary Chien, Taeho Kim

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Loot Price R4,613 Discovery Miles 46 130 | Repayment Terms: R432 pm x 12*

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The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: * the economic impact of employing the microelectronics fabricated by in dustry, * a study of the relationship between reliability and yield, * the progression toward miniaturization and higher reliability, and * the correctness and complexity of new system designs, which include a very significant portion of software.

General

Imprint: Springer-Verlag New York
Country of origin: United States
Release date: August 2014
First published: 1998
Authors: Way Kuo • Wei-Ting Kary Chien • Taeho Kim
Dimensions: 235 x 155 x 22mm (L x W x T)
Format: Paperback
Pages: 394
Edition: Softcover reprint of the original 1st ed. 1998
ISBN-13: 978-1-4613-7596-8
Categories: Books > Professional & Technical > Mechanical engineering & materials > Production engineering > General
Books > Professional & Technical > Energy technology & engineering > Electrical engineering > General
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
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LSN: 1-4613-7596-7
Barcode: 9781461375968

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