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Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components

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Integrated Circuit Packaging, Assembly and Interconnections (Hardcover, 2007 ed.) Loot Price: R3,059

Discovery Miles 30 590

Repayment Terms: R287 pm x 12*

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Integrated Circuit Packaging, Assembly and Interconnections (Hardcover, 2007 ed.): William Greig

Integrated Circuit Packaging, Assembly and Interconnections (Hardcover, 2007 ed.)

William Greig

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Loot Price R3,059 Discovery Miles 30 590 | Repayment Terms: R287 pm x 12*

Expected to ship within 10 - 15 working days

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Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.

General

Imprint:	Springer-Verlag New York
Country of origin:	United States
Release date:	March 2007
First published:	2007
Authors:	William Greig
Dimensions:	235 x 155 x 19mm (L x W x T)
Format:	Hardcover
Pages:	300
Edition:	2007 ed.
ISBN-13:	978-0-387-28153-7
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Promotions
LSN:	0-387-28153-3
Barcode:	9780387281537