Electrical Conductive Adhesives with Nanotechnologies begins
with an overview of electronic packaging and discusses the various
adhesives options currently available, including lead-free solder
and ECAs (Electrically Conductive Adhesives). The material
presented focuses on the three ECA categories specifically,
Isotropically Conductive Adhesives (ICAs) Anisotropically
Conductive Adhesives/Films (ACA/ACF) and Nonconductive
Adhesives/Films (NCA/NCF). Discussing the advantages and
limitations of each technique, and how each technique is currently
applied. Lastly, a detailed presentation of how nano techniques can
be applied to conductive adhesives is discussed, including recent
research and development of nano component adhesives/nano component
films, their electrical properties, thermal performance, bonding
pressure and assembly and reliability.
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