|
Books > Computing & IT > Computer communications & networking
|
Buy Now
Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement (Hardcover)
Loot Price: R3,545
Discovery Miles 35 450
|
|
|
Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement (Hardcover)
Expected to ship within 12 - 17 working days
|
As demand for on-chip functionalities and requirements for low
power operation continue to increase as a result of the emergence
in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D
have been identified as an inevitable path moving forward. As
circuits become more and more complex, especially three-dimensional
ones, new insights have to be developed in many domains, including
electrical, thermal, noise, interconnects, and parasites. It is the
entanglement of such domains that begins the very key challenge as
we enter in 3D nano-electronics. This book aims to develop this new
paradigm, going to a synthesis beginning between many technical
aspects.
General
Is the information for this product incomplete, wrong or inappropriate?
Let us know about it.
Does this product have an incorrect or missing image?
Send us a new image.
Is this product missing categories?
Add more categories.
Review This Product
No reviews yet - be the first to create one!
|
|
Email address subscribed successfully.
A activation email has been sent to you.
Please click the link in that email to activate your subscription.
Welcome to Loot.co.za!
Sign in / Register |Wishlists & Gift Vouchers |Help | Advanced search
