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This is the first single volume monograph that systematically
summarizes the recent progress in using non-Fourier heat conduction
theories to deal with the multiphysical behaviour of smart
materials and structures. The book contains six chapters and starts
with a brief introduction to Fourier and non-Fourier heat
conduction theories. Non-Fourier heat conduction theories include
Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL),
fractional phase-lag, and nonlocal phase-lag heat theories. Then,
the fundamentals of thermal wave characteristics are introduced
through reviewing the methods for solving non-Fourier heat
conduction theories and by presenting transient heat transport in
representative homogeneous and advanced heterogeneous materials.
The book provides the fundamentals of smart materials and
structures, including the background, application, and governing
equations. In particular, functionally-graded smart structures made
of piezoelectric, piezomagnetic, and magnetoelectroelastic
materials are introduced as they represent the recent development
in the industry. A series of uncoupled thermal stress analyses on
one-dimensional structures are also included. The volume ends with
coupled thermal stress analyses of one-dimensional homogenous and
heterogeneous smart piezoelectric structures considering different
coupled thermopiezoelectric theories. Last but not least, fracture
behavior of smart structures under thermal disturbance is
investigated and the authors propose directions for future research
on the topic of multiphysical analysis of smart materials.
This is the first single volume monograph that systematically
summarizes the recent progress in using non-Fourier heat conduction
theories to deal with the multiphysical behaviour of smart
materials and structures. The book contains six chapters and starts
with a brief introduction to Fourier and non-Fourier heat
conduction theories. Non-Fourier heat conduction theories include
Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL),
fractional phase-lag, and nonlocal phase-lag heat theories. Then,
the fundamentals of thermal wave characteristics are introduced
through reviewing the methods for solving non-Fourier heat
conduction theories and by presenting transient heat transport in
representative homogeneous and advanced heterogeneous materials.
The book provides the fundamentals of smart materials and
structures, including the background, application, and governing
equations. In particular, functionally-graded smart structures made
of piezoelectric, piezomagnetic, and magnetoelectroelastic
materials are introduced as they represent the recent development
in the industry. A series of uncoupled thermal stress analyses on
one-dimensional structures are also included. The volume ends with
coupled thermal stress analyses of one-dimensional homogenous and
heterogeneous smart piezoelectric structures considering different
coupled thermopiezoelectric theories. Last but not least, fracture
behavior of smart structures under thermal disturbance is
investigated and the authors propose directions for future research
on the topic of multiphysical analysis of smart materials.
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