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It is generally acknowledged that modeling and simulation are
preferred alternatives to trial and error approaches to
semiconductor fabrication in the present environment, where the
cost of process runs and associated mask sets is increasing
exponentially with successive technology nodes. Hence, accurate
physical device simulation tools are essential to accurately
predict device and circuit performance. Accurate thermal modelling
and the design of microelectronic devices and thin film structures
at the micro- and nanoscales poses a challenge to electrical
engineers who are less familiar with the basic concepts and ideas
in sub-continuum heat transport. This book aims to bridge that gap.
Efficient heat removal methods are necessary to increase device
performance and device reliability. The authors provide readers
with a combination of nanoscale experimental techniques and
accurate modelling methods that must be employed in order to
determine a device's temperature profile.
It is generally acknowledged that modeling and simulation are
preferred alternatives to trial and error approaches to
semiconductor fabrication in the present environment, where the
cost of process runs and associated mask sets is increasing
exponentially with successive technology nodes. Hence, accurate
physical device simulation tools are essential to accurately
predict device and circuit performance. Accurate thermal modelling
and the design of microelectronic devices and thin film structures
at the micro- and nanoscales poses a challenge to electrical
engineers who are less familiar with the basic concepts and ideas
in sub-continuum heat transport. This book aims to bridge that gap.
Efficient heat removal methods are necessary to increase device
performance and device reliability. The authors provide readers
with a combination of nanoscale experimental techniques and
accurate modelling methods that must be employed in order to
determine a device's temperature profile.
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