Circuit analysis is the fundamental gateway course for computer and electrical engineering majors. Engineering Circuit Analysis has long been regarded as the most dependable textbook. Irwin and Nelms has long been known for providing the best supported learning for students otherwise intimidated by the subject matter. In this new 11th edition, Irwin and Nelms continue to develop the most complete set of pedagogical tools available and thus provide the highest level of support for students entering into this complex subject. Irwin and Nelms trademark student-centered learning design focuses on helping students complete the connection between theory and practice. Key concepts are explained clearly and illustrated by detailed worked examples. These are then followed by Learning Assessments, which allow students to work similar problems and check their results against the answers provided. The WileyPLUS course contains tutorial videos that show solutions to the Learning Assessments in detail, and also includes a robust set of algorithmic problems at a wide range of difficulty levels. WileyPLUS sold separately from text.

This book discusses the development of promising technologies for compact antennas for high data-rate communications. It discusses and analyzes the design of compact ultra-wideband (UWB) and multiple input, multiple output (MIMO) antennas, providing essential know-how for designers, practicing engineers and scientists. These wireless communication technologies enable consumers to have convenient access to a wide range of services - anytime, anywhere. And the introduction of wireless mobile access points eliminates the limitations to communication imposed by geographical location. The Internet has allowed people to access and share information much more rapidly, but in order to achieve higher data rates with the limited available resources and imposed constraints, wireless communication technology needs to be pushed beyond the physical limits of the propagation channel. This book contributes to achieving this goal.

The book provides accurate FDTD models for on-chip interconnects, covering most recent advancements in materials and design. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for CNT and GNR based interconnects are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR-based interconnects are also discussed in the book. The proposed models are validated with the HSPICE simulations. The book introduces the current research scenario in the modeling of on-chip interconnects. It presents the structure, properties, and characteristics of graphene based on-chip interconnects and the FDTD modeling of Cu based on-chip interconnects. The model considers the non-linear effects of CMOS driver as well as the transmission line effects of interconnect line that includes coupling capacitance and mutual inductance effects. In a more realistic manner, the proposed model includes the effect of width-dependent MFP of the MLGNR while taking into account the edge roughness.