This book discusses the development of promising technologies for compact antennas for high data-rate communications. It discusses and analyzes the design of compact ultra-wideband (UWB) and multiple input, multiple output (MIMO) antennas, providing essential know-how for designers, practicing engineers and scientists. These wireless communication technologies enable consumers to have convenient access to a wide range of services - anytime, anywhere. And the introduction of wireless mobile access points eliminates the limitations to communication imposed by geographical location. The Internet has allowed people to access and share information much more rapidly, but in order to achieve higher data rates with the limited available resources and imposed constraints, wireless communication technology needs to be pushed beyond the physical limits of the propagation channel. This book contributes to achieving this goal.

The book provides accurate FDTD models for on-chip interconnects, covering most recent advancements in materials and design. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for CNT and GNR based interconnects are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR-based interconnects are also discussed in the book. The proposed models are validated with the HSPICE simulations. The book introduces the current research scenario in the modeling of on-chip interconnects. It presents the structure, properties, and characteristics of graphene based on-chip interconnects and the FDTD modeling of Cu based on-chip interconnects. The model considers the non-linear effects of CMOS driver as well as the transmission line effects of interconnect line that includes coupling capacitance and mutual inductance effects. In a more realistic manner, the proposed model includes the effect of width-dependent MFP of the MLGNR while taking into account the edge roughness.