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VLSI-SoC: Design Trends - 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, Salt... VLSI-SoC: Design Trends - 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, Salt Lake City, UT, USA, October 6-9, 2020, Revised and Extended Selected Papers (Hardcover, 1st ed. 2021)
Andrea Calimera, Pierre-Emmanuel Gaillardon, Kunal Korgaonkar, Shahar Kvatinsky, Ricardo Reis
R3,384 Discovery Miles 33 840 Ships in 18 - 22 working days

This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.*The 16 full papers included in this volume were carefully reviewed and selected from the 38 papers (out of 74 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs. *The conference was held virtually.

VLSI-SoC: Technology Advancement on SoC Design - 29th IFIP WG 10.5/IEEE International Conference on Very Large Scale... VLSI-SoC: Technology Advancement on SoC Design - 29th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2021, Singapore, October 4-8, 2021, Revised and Extended Selected Papers (Hardcover, 1st ed. 2022)
Victor Grimblatt, Chip-Hong Chang, Ricardo Reis, Anupam Chattopadhyay, Andrea Calimera
R1,433 Discovery Miles 14 330 Ships in 18 - 22 working days

This book contains extended and revised versions of the best papers presented at the 29th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2021, held in Singapore, in October 2021*. The 12 full papers included in this volume were carefully reviewed and selected from the 44 papers (out of 75 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs. *The conference was held virtually.

VLSI-SoC: Design Trends - 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, Salt... VLSI-SoC: Design Trends - 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, Salt Lake City, UT, USA, October 6-9, 2020, Revised and Extended Selected Papers (Paperback, 1st ed. 2021)
Andrea Calimera, Pierre-Emmanuel Gaillardon, Kunal Korgaonkar, Shahar Kvatinsky, Ricardo Reis
R3,356 Discovery Miles 33 560 Ships in 18 - 22 working days

This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.*The 16 full papers included in this volume were carefully reviewed and selected from the 38 papers (out of 74 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs. *The conference was held virtually.

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