There is a great deal of interest in extending nondestructive technologies beyond the location and identification of cracks and voids. Specifically there is growing interest in the application of nondestructive evaluation (NOEl to the measurement of physical and mechanical properties of materials. The measurement of materials properties is often referred to as materials characterization; thus nondestructive techniques applied to characterization become nondestructive characterization (NDCl. There are a number of meetings, proceedings and journals focused upon nondestructive technologies and the detection and identification of cracks and voids. However, the series of symposia, of which these proceedings represent the fourth, are the only meetings uniquely focused upon nondestructive characterization. Moreover, these symposia are especially concerned with stimulating communication between the materials, mechanical and manufacturing engineer and the NDE technology oriented engineer and scientist. These symposia recognize that it is the welding of these areas of expertise that is necessary for practical development and application of NDC technology to measurements of components for in service life time and sensor technology for intelligent processing of materials. These proceedings are from the fourth international symposia and are edited by c.o. Ruud, J. F. Bussiere and R.E. Green, Jr. . The dates, places, etc of the symposia held to date area as follows: Symposia on Nondestructive Methods for TITLE: Material Property Determination DATES: April 6-8, 1983 PLACE: Hershey, PA, USA CHAIRPERSONS: C.O. Ruud and R.E. Green, Jr."

There is a great deal of interest in extending nondestructive technologies beyond the location and identification of cracks and voids. Specifically there is growing interest in the application of nondestructive evaluation (NOEl to the measurement of physical and mechanical properties of materials. The measurement of materials properties is often referred to as materials characterization; thus nondestructive techniques applied to characterization become nondestructive characterization (NDCl. There are a number of meetings, proceedings and journals focused upon nondestructive technologies and the detection and identification of cracks and voids. However, the series of symposia, of which these proceedings represent the fourth, are the only meetings uniquely focused upon nondestructive characterization. Moreover, these symposia are especially concerned with stimulating communication between the materials, mechanical and manufacturing engineer and the NDE technology oriented engineer and scientist. These symposia recognize that it is the welding of these areas of expertise that is necessary for practical development and application of NDC technology to measurements of components for in service life time and sensor technology for intelligent processing of materials. These proceedings are from the fourth international symposia and are edited by c.o. Ruud, J. F. Bussiere and R.E. Green, Jr. . The dates, places, etc of the symposia held to date area as follows: Symposia on Nondestructive Methods for TITLE: Material Property Determination DATES: April 6-8, 1983 PLACE: Hershey, PA, USA CHAIRPERSONS: C.O. Ruud and R.E. Green, Jr."

The interest in materials property determination by nondestructive means is increasing especially for in-process and in-service inspection of structural and electronic materials and components. Such attention is due to several factors, including increased automation of manufacturing processes, the demand for greater reliability in consumer products and military hardware, and more severe demands on the performance of materials. This book represents the proceedings for the Symposium on Nondestructive Hethods for Haterial Property Determination held April 6 to 8, 1983, at the Hotel Hershey in Hershey, Pennsylvania. That symposium was one of the first meetings concerned specifically with nondestructive material property determination (characteriza tion). Its purpose was to stimulate intercourse between researchers, engineers, and theoreticians so as to focus upon the multidiseiplinary problems of advancing the state of the art in this area. The papers in the book are concerned mainly with acoustic (including ultrasonic), magnetic, electrical, and x-ray diffraction techniques and applications. Hany of the papers describe well developed technologies that are currently in practical application, while others discuss concepts which will never emerge from the laboratory but perhaps will provide the groundwork for more practical ideas."